Invention Grant
- Patent Title: Relay with snap action spring
- Patent Title (中): 带动作弹簧的继电器
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Application No.: US12618289Application Date: 2009-11-13
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Publication No.: US08237523B2Publication Date: 2012-08-07
- Inventor: Johannes Helmreich
- Applicant: Johannes Helmreich
- Applicant Address: AT Vienna
- Assignee: Tyco Electronics Austria GmbH
- Current Assignee: Tyco Electronics Austria GmbH
- Current Assignee Address: AT Vienna
- Agency: Barley Snyder
- Priority: DE102008057555 20081115
- Main IPC: H01H51/22
- IPC: H01H51/22 ; H01H5/00

Abstract:
The relay has a movable first contact, a second contact, and an actuating element operatively connected with an armature of the relay. The first contact is movable toward the second contact by the actuating element and dependent on a supply of current to the relay. A snap action spring connects the second contact to a housing of the relay. The second contact is positioned between two arrangements by the snap action spring.
Public/Granted literature
- US20100123533A1 Relay With Snap Action Spring Public/Granted day:2010-05-20
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