Invention Grant
- Patent Title: Heat transfer system for memory modules
- Patent Title (中): 内存模块传热系统
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Application No.: US12201524Application Date: 2008-08-29
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Publication No.: US08238101B2Publication Date: 2012-08-07
- Inventor: Sven Kalms , Christian Weiss
- Applicant: Sven Kalms , Christian Weiss
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Patterson & Sheridan, LLP
- Priority: DE102007045733 20070925
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34 ; H01R13/62
Abstract:
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
Public/Granted literature
- US20090080151A1 HEAT TRANSFER SYSTEM Public/Granted day:2009-03-26
Information query
