Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12843063Application Date: 2010-07-26
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Publication No.: US08238111B2Publication Date: 2012-08-07
- Inventor: Cheng-Sung Wang
- Applicant: Cheng-Sung Wang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01R9/00

Abstract:
A printed circuit board includes a signal layer, a power layer, and a ground layer. The signal layer includes an analog audio input/output (I/O) port and an audio chip. The audio chip includes a main body, a first group of signal pins connected to the analog audio I/O port and a second group of signal pins connected to a control chip. The power layer and the ground layer each is divided into two unconnected parts, an audio part and a digital part, by a dividing groove. The two audio parts act as a whole reference plane for traces between the analog audio I/O port and the first group of signal pins of the audio chip. The two digital parts act as reference planes for traces between the control chip and the second group of signal pins of the audio chip.
Public/Granted literature
- US20120020043A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-01-26
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