Invention Grant
- Patent Title: Multilayer printed circuit board
- Patent Title (中): 多层印刷电路板
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Application No.: US12757418Application Date: 2010-04-09
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Publication No.: US08238700B2Publication Date: 2012-08-07
- Inventor: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-308781 20041022
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/10

Abstract:
A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.
Public/Granted literature
- US20100195954A1 MULTILAYER PRINTED CIRCUIT BOARD Public/Granted day:2010-08-05
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