Invention Grant
- Patent Title: Light-emitting heat treatment apparatus
- Patent Title (中): 发光热处理装置
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Application No.: US12395940Application Date: 2009-03-02
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Publication No.: US08238731B2Publication Date: 2012-08-07
- Inventor: Toshihiro Nakajima
- Applicant: Toshihiro Nakajima
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-077130 20080325
- Main IPC: A21B2/00
- IPC: A21B2/00

Abstract:
Annular reflecting rings are removably mounted on the upper and lower sides of a chamber side portion of a chamber. An annular recessed portion is formed sandwiched between the lower end face of the upper reflecting ring and the upper end face of the lower reflecting ring to surround a holding part for holding a semiconductor wafer. The outer peripheral surface of the recessed portion communicates with a transport opening. The formation of the recessed portion prevents the light emitted from halogen lamps and flash lamps from being non-uniformly reflected around the holding part to enter a semiconductor wafer, thus improving the uniformity of the in-plane temperature distribution in the semiconductor wafer during heat treatment.
Public/Granted literature
- US20090245761A1 LIGHT-EMITTING HEAT TREATMENT APPARATUS Public/Granted day:2009-10-01
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