Invention Grant
- Patent Title: Test apparatus and manufacturing method
- Patent Title (中): 试验装置及制造方法
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Application No.: US12388521Application Date: 2009-02-19
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Publication No.: US08239147B2Publication Date: 2012-08-07
- Inventor: Daisuke Watanabe , Toshiyuki Okayasu
- Applicant: Daisuke Watanabe , Toshiyuki Okayasu
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R21/00

Abstract:
Provided is a test apparatus that tests a device under test, comprising a test signal generating section that generates a test signal to be applied to the device under test; a first driver that is electrically connected to a terminal of the device under test and that supplies the test signal to the terminal of the device under test; a correction signal generating section that generates a correction signal for correcting attenuation of the test signal occurring until the test signal reaches the terminal of the device under test; and a second driver that is electrically connected to the terminal of the device under test and that supplies the correction signal to the terminal of the device under test.
Public/Granted literature
- US20100049453A1 TEST APPARATUS AND MANUFACTURING METHOD Public/Granted day:2010-02-25
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