Invention Grant
- Patent Title: System and method for wireless and dynamic intra-process measurement of integrated circuit parameters
- Patent Title (中): 集成电路参数的无线和动态过程内测量的系统和方法
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Application No.: US12053705Application Date: 2008-03-24
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Publication No.: US08239811B2Publication Date: 2012-08-07
- Inventor: Theodoros E. Anemikos , Phillip L. Corson , Mete Erturk , Ezra D. B. Hall , Anthony J. Perri , Sebastian T. Ventrone
- Applicant: Theodoros E. Anemikos , Phillip L. Corson , Mete Erturk , Ezra D. B. Hall , Anthony J. Perri , Sebastian T. Ventrone
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Agent Michael J. LeStrange, Esq.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F11/22

Abstract:
Disclosed are embodiments of a system and a method that allow for wireless and dynamic intra-process (i.e., during and/or between process steps) measurements of integrated circuit parameters. The embodiments incorporate the use of a passive circuit, such as an inductor-capacitor-resistor (LCR) circuit resonator, that has a predetermined sensitivity to process variations in one or more physical or electrical integrated circuit parameters. The passive circuit can be wirelessly interrogated between and/or process steps. Then, the actual behavior exhibited by the passive circuit in response to the interrogation is compared to the expected behavior of an optimal circuit in the absence of process variations in order to determine the one or more parameters. Also disclosed is an embodiment of an exemplary passive circuit that can be used to implement the disclosed system and method embodiments.
Public/Granted literature
- US20090240452A1 SYSTEM AND METHOD FOR WIRELESS AND DYNAMIC INTRA-PROCESS MEASUREMENT OF INTEGRATED CIRCUIT PARAMETERS Public/Granted day:2009-09-24
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