Invention Grant
- Patent Title: Highly integrated single chip set-top box
- Patent Title (中): 高度集成的单芯片机顶盒
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Application No.: US11187009Application Date: 2005-07-22
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Publication No.: US08239914B2Publication Date: 2012-08-07
- Inventor: Martin Kuhlmann , Ramon A. Gomez , Loke Tan
- Applicant: Martin Kuhlmann , Ramon A. Gomez , Loke Tan
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04N7/16
- IPC: H04N7/16

Abstract:
A highly integrated set-top box is implemented on a single semiconductor substrate. For instance, an analog RF tuner is implemented on the same substrate with a digital receiver, and audio-video back-end circuits. The single chip set-top box can be used for satellite, cable, internet, or terrestrial TV applications, or other applications. As a result, the substrate area, assembly time, and associated costs per chip are reduced.
Public/Granted literature
- US20060026657A1 Highly integrated single chip set-top box Public/Granted day:2006-02-02
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