Invention Grant
- Patent Title: Lithographically defined adhesion microstructures
- Patent Title (中): 光刻定义的粘结微观结构
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Application No.: US12572036Application Date: 2009-10-01
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Publication No.: US08241547B2Publication Date: 2012-08-14
- Inventor: Axel Scherer , Aditya Rajagopal
- Applicant: Axel Scherer , Aditya Rajagopal
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Steinfl & Bruno, LLP
- Main IPC: B29C45/16
- IPC: B29C45/16
Abstract:
A method for adhering two layers of materials is described. An additional layer of material deposited on one of the layers is used. The additional layer of material is perforated and undercut by etching away one of the layers thereby generating anchor shaped holes. The other layer is then deposited on the additional layer filling the anchor shaped holes therefore, providing adhesion.
Public/Granted literature
- US20100126653A1 LITHOGRAPHICALLY DEFINED ADHESION MICROSTRUCTURES Public/Granted day:2010-05-27
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