Invention Grant
US08241760B2 Joint structure, joining method, wiring board and method for producing the same
失效
接头结构，接合方法，接线板及其制造方法
- Patent Title: Joint structure, joining method, wiring board and method for producing the same
- Patent Title (中): 接头结构，接合方法，接线板及其制造方法
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Application No.: US12440986Application Date: 2006-09-14
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Publication No.: US08241760B2Publication Date: 2012-08-14
- Inventor: Toshiaki Chuma
- Applicant: Toshiaki Chuma
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- International Application: PCT/JP2006/318279 WO 20060914
- International Announcement: WO2008/032386 WO 20080320
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B15/20 ; H05K3/00 ; B23K20/00 ; H01R4/00 ; H01R4/02
Abstract:
A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.
Public/Granted literature
- US20090264028A1 JOINT STRUCTURE, JOINING METHOD, WIRING BOARD AND METHOD FOR PRODUCING THE SAME Public/Granted day:2009-10-22
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