Invention Grant
US08242373B2 Flexible wiring board with characteristic impedance control circuit
有权
具有特性阻抗控制电路的柔性线路板
- Patent Title: Flexible wiring board with characteristic impedance control circuit
- Patent Title (中): 具有特性阻抗控制电路的柔性线路板
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Application No.: US12227365Application Date: 2007-06-06
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Publication No.: US08242373B2Publication Date: 2012-08-14
- Inventor: Seiichiro Miyahara
- Applicant: Seiichiro Miyahara
- Applicant Address: JP Tokyo-To
- Assignee: Nippon Mektron, Ltd.
- Current Assignee: Nippon Mektron, Ltd.
- Current Assignee Address: JP Tokyo-To
- Agency: Jacobson Holman PLLC
- Priority: JP2006-231801 20060829
- International Application: PCT/JP2007/061426 WO 20070606
- International Announcement: WO2008/026359 WO 20080306
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.
Public/Granted literature
- US20090236126A1 Flexible Wiring Board Public/Granted day:2009-09-24
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