Invention Grant
US08242612B2 Wiring board having piercing linear conductors and semiconductor device using the same
有权
具有穿孔线性导体的接线板和使用其的半导体器件
- Patent Title: Wiring board having piercing linear conductors and semiconductor device using the same
- Patent Title (中): 具有穿孔线性导体的接线板和使用其的半导体器件
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Application No.: US12813692Application Date: 2010-06-11
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Publication No.: US08242612B2Publication Date: 2012-08-14
- Inventor: Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
- Applicant: Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2009-170469 20090721
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/00

Abstract:
A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
Public/Granted literature
- US20110018144A1 WIRING BOARD AND SEMICONDUCTOR DEVICE Public/Granted day:2011-01-27
Information query
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