Invention Grant
- Patent Title: Structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle
- Patent Title (中): 用于风扇无人驾驶飞行器的结构环互连印刷电路板组件
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Application No.: US12270196Application Date: 2008-11-13
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Publication No.: US08242623B2Publication Date: 2012-08-14
- Inventor: Michael Lucero , Daniel Ross Collette , David Axtman
- Applicant: Michael Lucero , Daniel Ross Collette , David Axtman
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle that comprises a printed circuit board attached to a core vehicle body, wherein the printed circuit board conforms to the shape of the core vehicle body's airframe skirt, and wherein the printed circuit board provides structural integrity to the core vehicle body.
Public/Granted literature
- US20100120273A1 STRUCTURAL RING INTERCONNECT PRINTED CIRCUIT BOARD ASSEMBLY FOR A DUCTED FAN UNMANNED AERIAL VEHICLE Public/Granted day:2010-05-13
Information query
