Invention Grant
US08243245B2 BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure
有权
具有BSC宏观结构的三维布线和基板的BSC宏观结构
- Patent Title: BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure
- Patent Title (中): 具有BSC宏观结构的三维布线和基板的BSC宏观结构
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Application No.: US12077179Application Date: 2008-03-17
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Publication No.: US08243245B2Publication Date: 2012-08-14
- Inventor: Seisei Oyamada
- Applicant: Seisei Oyamada
- Applicant Address: JP Yokohama, Kanagawa
- Assignee: Liquid Design Systems Inc.
- Current Assignee: Liquid Design Systems Inc.
- Current Assignee Address: JP Yokohama, Kanagawa
- Agency: Collard & Roe, P.C.
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; G01R31/28

Abstract:
A BSC macrostructure for three-dimensional wiring includes a BSC (boundary scan cell) and an aperture electrode for electrode connection which is connected to the BSC.
Public/Granted literature
- US20090235135A1 BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure Public/Granted day:2009-09-17
Information query
IPC分类: