Invention Grant
- Patent Title: Component joining structure, IC card, and connector
- Patent Title (中): 元件接合结构,IC卡和连接器
-
Application No.: US12659319Application Date: 2010-03-04
-
Publication No.: US08243456B2Publication Date: 2012-08-14
- Inventor: Akihiro Tochi , Masaki Tsujimoto
- Applicant: Akihiro Tochi , Masaki Tsujimoto
- Applicant Address: JP Osaka
- Assignee: J.S.T. Mfg. Co., Ltd.
- Current Assignee: J.S.T. Mfg. Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2009-056081 20090310
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
An ultrasonic weld is provided in a cover component, is formed protruding from the cover component, and is provided so that it can join the cover component and the body component together by being fixed to the body component with ultrasonic welding. A locking mechanism is provided so that it can join the cover component and the body component together via engaging portions that engage with each other. The locking mechanism includes a first engaging portion provided in the cover component, and a second engaging portion that is provided in another component fixed to the body component, and that can engage with the first engaging portion. Thus, it is possible to decrease the number of components, and also reduce equipment costs and production control costs.
Public/Granted literature
- US20100232118A1 Component joining structure, IC card, and connector Public/Granted day:2010-09-16
Information query