Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12872652Application Date: 2010-08-31
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Publication No.: US08243466B2Publication Date: 2012-08-14
- Inventor: Shi-Piao Luo , Chia-Nan Pai , Shou-Kuo Hsu
- Applicant: Shi-Piao Luo , Chia-Nan Pai , Shou-Kuo Hsu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010242441 20100802
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.
Public/Granted literature
- US20120026707A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-02-02
Information query
