Invention Grant
US08245393B2 Method for fabricating a circuit board including aligned nanostructures
有权
用于制造包括排列的纳米结构的电路板的方法
- Patent Title: Method for fabricating a circuit board including aligned nanostructures
- Patent Title (中): 用于制造包括排列的纳米结构的电路板的方法
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Application No.: US12234529Application Date: 2008-09-19
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Publication No.: US08245393B2Publication Date: 2012-08-21
- Inventor: Seung Hun Hong , Sung Myung , Ju Wan Kang
- Applicant: Seung Hun Hong , Sung Myung , Ju Wan Kang
- Applicant Address: KR Seoul
- Assignee: SNU R&DB Foundation
- Current Assignee: SNU R&DB Foundation
- Current Assignee Address: KR Seoul
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: KR10-2008-0076382 20080805
- Main IPC: H01K3/00
- IPC: H01K3/00
Abstract:
A method for fabricating a circuit board includes providing a first substrate, forming a circuit on the first substrate, the circuit having a first electrode, a second electrode and at least one nanostructure, and transferring the circuit from the first substrate to a surface of a second substrate made of a polymer.
Public/Granted literature
- US20100032197A1 CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES Public/Granted day:2010-02-11
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