Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and program storage medium
- Patent Title (中): 基板处理装置,基板处理方法和程序存储介质
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Application No.: US12474336Application Date: 2009-05-29
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Publication No.: US08246759B2Publication Date: 2012-08-21
- Inventor: Norihiro Itoh , Jiro Higashijima
- Applicant: Norihiro Itoh , Jiro Higashijima
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown
- Priority: JP2008-145736 20080603; JP2008-145744 20080603
- Main IPC: B08B3/00
- IPC: B08B3/00

Abstract:
There is provided a substrate processing apparatus capable of stably holding a substrate and properly processing the substrate. The substrate processing apparatus is an apparatus that processes a substrate while rotating the substrate, with a place surface of the substrate being oriented in a horizontal direction. The substrate processing apparatus comprises a table including a rotatable base plate having a plurality of projecting members projected outward, and a rotation driving mechanism that rotates the base plate. The table can rotatably hold the substrate such that the projecting members contact the substrate from below with a gap formed between the substrate and the table. The substrate processing apparatus further comprises a pressure adjusting apparatus including a suction duct line having one end thereof being opened to the gap, and a suction mechanism connected to the other end of the suction duct line.
Public/Granted literature
- US20090297705A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND PROGRAM STORAGE MEDIUM Public/Granted day:2009-12-03
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