Invention Grant
- Patent Title: Electroconductive particle placement sheet and anisotropic electroconductive film
- Patent Title (中): 导电颗粒放置片和各向异性导电膜
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Application No.: US12226670Application Date: 2007-04-26
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Publication No.: US08247701B2Publication Date: 2012-08-21
- Inventor: Taketoshi Usui , Hitoshi Shimada
- Applicant: Taketoshi Usui , Hitoshi Shimada
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei EMD Corporation
- Current Assignee: Asahi Kasei EMD Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-123162 20060427
- International Application: PCT/JP2007/059054 WO 20070426
- International Announcement: WO2007/125993 WO 20071108
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P1) on at least one side of the insulating resin sheet. The electroconductive particle in is part protruded from the reference plane (P1) is covered with a layer formed of the same resin as in the insulating resin sheet.
Public/Granted literature
- US20090090545A1 Electroconductive Particle Placement Sheet and Anisotropic Electroconductive Film Public/Granted day:2009-04-09
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