Invention Grant
US08247703B2 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
失效
制造具有电阻器的电路化基板的方法，包括具有金属部件的材料和利用所述电路化基板的电气组件和信息处理系统
- Patent Title: Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
- Patent Title (中): 制造具有电阻器的电路化基板的方法，包括具有金属部件的材料和利用所述电路化基板的电气组件和信息处理系统
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Application No.: US12938759Application Date: 2010-11-03
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Publication No.: US08247703B2Publication Date: 2012-08-21
- Inventor: Rabindra N. Das , John M. Lauffer , Voya R. Markovich
- Applicant: Rabindra N. Das , John M. Lauffer , Voya R. Markovich
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell, LLP
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
Public/Granted literature
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