Invention Grant
- Patent Title: Printing shielded connections and circuits
- Patent Title (中): 打印屏蔽连接和电路
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Application No.: US12328694Application Date: 2008-12-04
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Publication No.: US08247883B2Publication Date: 2012-08-21
- Inventor: Jurgen H. Daniel , Tse Nga Ng
- Applicant: Jurgen H. Daniel , Tse Nga Ng
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Blakely Sokoloff Taylor & Zafman, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522

Abstract:
An embodiment is a method and apparatus to construct a shielded cable, wire, or circuit. A first insulator layer is deposited on a first conductor or semiconductor layer. A second conductor or semiconductor layer is deposited on the first insulator layer. A second insulator layer is deposited on the first insulator layer. The second insulator layer covers the second conductor or semiconductor layer and defines a shielded region. A third conductor or semiconductor layer is deposited on the first conductor or semiconductor layer. The third conductor or semiconductor layer covers the first and second insulator layers. At least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing.
Public/Granted literature
- US20100140673A1 PRINTING SHIELDED CONNECTIONS AND CIRCUITS Public/Granted day:2010-06-10
Information query
IPC分类: