Invention Grant
- Patent Title: Spindle device
- Patent Title (中): 主轴装置
-
Application No.: US12641989Application Date: 2009-12-18
-
Publication No.: US08253575B2Publication Date: 2012-08-28
- Inventor: Shigeru Matsunaga
- Applicant: Shigeru Matsunaga
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-005792 20090114
- Main IPC: G08B17/00
- IPC: G08B17/00

Abstract:
A spindle device is provided with a temperature sensor for detecting the temperature of an antifriction bearing or the temperature of a part of either one of a housing and a spindle which part is influenced by a temperature change of the antifriction bearing, and an abnormality detection section for detecting the abnormality of the antifriction bearing based on the change speed of the temperature of the antifriction bearing detected by the temperature sensor, so that the abnormality of the antifriction bearing can be detected more precisely.
Public/Granted literature
- US20100178001A1 SPINDLE DEVICE Public/Granted day:2010-07-15
Information query