A machine tool with a heat conduction structure comprises a machine tool and a heat dissipation seat installed on the machine tool. The machine tool has a handle. The handle has an accommodation space accommodating a circuit board and having an opening at one end. The heat dissipation seat has a heat dissipation member arranged on the opening and a carrying member connected with the heat dissipation member and extended to the accommodation space. The carrying member carries the circuit board, contacts heat sources of the circuit board, and conducts heat to the heat dissipation member. As the machine tool is exempted from forming heat dissipation holes on the handle, the present invention can effectively prevent dust from entering the handle and damaging the circuit board. Further, the present invention can dissipate heat generated by the circuit board and maintain normal operation of the circuit board and the machine tool.