Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US12630574Application Date: 2009-12-03
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Publication No.: US08254129B2Publication Date: 2012-08-28
- Inventor: Isao Okutsu
- Applicant: Isao Okutsu
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2009-082334 20090330
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component.
Public/Granted literature
- US20100246125A1 Electronic Apparatus Public/Granted day:2010-09-30
Information query
