Invention Grant
- Patent Title: Molded memory card with write protection switch assembly
- Patent Title (中): 带有写保护开关组合的成型存储卡
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Application No.: US12684841Application Date: 2010-01-08
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Publication No.: US08254134B2Publication Date: 2012-08-28
- Inventor: Siew S. Hiew , Abraham C. Ma , Nan Nan
- Applicant: Siew S. Hiew , Abraham C. Ma , Nan Nan
- Applicant Address: US CA San Jose
- Assignee: Super Talent Electronics, Inc.
- Current Assignee: Super Talent Electronics, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Bever, Hoffman & Harms, LLP
- Agent Patrick T. Bever
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot.
Public/Granted literature
- US20100110647A1 Molded Memory Card With Write Protection Switch Assembly Public/Granted day:2010-05-06
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