Invention Grant
- Patent Title: Backplane and communication apparatus
- Patent Title (中): 背板和通讯设备
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Application No.: US12265691Application Date: 2008-11-05
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Publication No.: US08254143B2Publication Date: 2012-08-28
- Inventor: Yumin Du
- Applicant: Yumin Du
- Applicant Address: CN Chengdu
- Assignee: Chengdu Huawei Symantec Technologies Co., Ltd.
- Current Assignee: Chengdu Huawei Symantec Technologies Co., Ltd.
- Current Assignee Address: CN Chengdu
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN200810000354 20080110
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
The present invention discloses a communication apparatus. The communication apparatus includes one or more board and a backplane. The board includes a connector and a function processing unit circuit connected to the connector. The backplane includes at least one group of board connectors. Each group of the board connectors includes two board connectors that receive signals from different boards. The board connector includes connection terminals connected to the connector on boards. The two board connectors are distributed up and down, and the connection terminals of the two board connectors are distributed symmetrically around a center. The foregoing communication apparatus and backplane are cost-efficient.
Public/Granted literature
- US20090182922A1 BACKPLANE AND COMMUNICATION APPARATUS Public/Granted day:2009-07-16
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