Invention Grant
- Patent Title: Semiconductor having enhanced carbon doping
- Patent Title (中): 具有增强碳掺杂的半导体
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Application No.: US12973754Application Date: 2010-12-20
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Publication No.: US08254424B2Publication Date: 2012-08-28
- Inventor: Ralph H. Johnson
- Applicant: Ralph H. Johnson
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Gilmore & Israelsen
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
Methods for fabricating semiconductors with enhanced strain. One embodiment includes fabrication of a semiconductor device with an epitaxial structure. The epitaxial structure is formed with one or more semiconductor layers. One or more of the layers includes a dopant including small quantities of Al and repeated delta doping during expitaxial growth to form periods where surfaces are group III rich.
Public/Granted literature
- US20110086452A1 SEMICONDUCTOR HAVING ENHANCED CARBON DOPING Public/Granted day:2011-04-14
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