Invention Grant
- Patent Title: High demand sale processing
- Patent Title (中): 高需求销售加工
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Application No.: US12364677Application Date: 2009-02-03
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Publication No.: US08255288B1Publication Date: 2012-08-28
- Inventor: Diwakar Gupta , Paul C. Schattauer , Chih-Jen Huang , Philip Yuen , Ammar Chinoy , Kiran Kumar Meduri
- Applicant: Diwakar Gupta , Paul C. Schattauer , Chih-Jen Huang , Philip Yuen , Ammar Chinoy , Kiran Kumar Meduri
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Lee & Hayes, PLLC
- Main IPC: G06Q30/00
- IPC: G06Q30/00

Abstract:
Item scarcity resulting from a high demand of the item is addressed by providing users a high demand sale process. In some aspects, users may opt-in to purchase the item in a sale by transmitting a mobile message to a host over a mobile device network prior to a sale of the item. If the user is eligible, the host then attempts to purchase the item on behalf of the user once the sale begins.
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