Invention Grant
- Patent Title: Method for manufacturing a coil device
- Patent Title (中): 线圈装置的制造方法
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Application No.: US12681080Application Date: 2008-09-26
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Publication No.: US08256097B2Publication Date: 2012-09-04
- Inventor: Hitoshi Yoshimori
- Applicant: Hitoshi Yoshimori
- Applicant Address: JP Izumisano-shi, Osaka
- Assignee: SHT Corporation Limited
- Current Assignee: SHT Corporation Limited
- Current Assignee Address: JP Izumisano-shi, Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-258394 20071002
- International Application: PCT/JP2008/067453 WO 20080926
- International Announcement: WO2009/044676 WO 20090409
- Main IPC: H01F7/06
- IPC: H01F7/06

Abstract:
A method for manufacturing a coil device comprises a first step of twisting a tip end part of the conductive wire by approximately 90 degrees with respect to a conductive wire portion arranged rearward continuously from the tip end part to form a twist part, and winding the tip end part of the conductive wire around the outer peripheral surface of the core in a lying posture on the outer peripheral surface; a second step of winding the conductive wire arranged rearward continuously from the twist part around the outer periphery surface of the core in a standing posture on the outer peripheral surface; and a third step of transforming the conductive wire on a tip end side with respect to the twist part in a direction apart from the outer periphery surface of the core to form one lead part extending substantially linearly.
Public/Granted literature
- US20100218366A1 COIL DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2010-09-02
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