Invention Grant
- Patent Title: Method for fabricating circuit board structure with capacitors embedded therein
- Patent Title (中): 制造电容器结构的方法,其中嵌入电容器
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Application No.: US12010345Application Date: 2008-01-24
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Publication No.: US08256106B2Publication Date: 2012-09-04
- Inventor: Chung-Cheng Lien , Chih-Kui Yang
- Applicant: Chung-Cheng Lien , Chih-Kui Yang
- Applicant Address: TW
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Priority: TW96102784A 20070125
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K3/02 ; H05K3/32 ; H05K3/42 ; H05K3/46

Abstract:
A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.
Public/Granted literature
- US20080210460A1 Circuit board structure with capacitors embedded therein and method for fabricating the same Public/Granted day:2008-09-04
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