Invention Grant
- Patent Title: Apparatus and method for inspecting sensor module
- Patent Title (中): 检测传感器模块的装置和方法
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Application No.: US12318257Application Date: 2008-12-23
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Publication No.: US08256265B2Publication Date: 2012-09-04
- Inventor: Hiroshi Kobayashi , Masaki Nakiri , Nobuhiro Kohno
- Applicant: Hiroshi Kobayashi , Masaki Nakiri , Nobuhiro Kohno
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-332444 20071225
- Main IPC: G01P21/00
- IPC: G01P21/00

Abstract:
The present invention provides, as one aspect, an apparatus for inspecting a sensor module including at least one held sensor in a housing having a plurality of outer surfaces. The held sensor detects acceleration or angular velocity. The apparatus includes a holding unit that has an apparatus-side surface and holds the housing in a state where one of the outer surfaces of the housing serving as a housing-side surface contacts the apparatus-side surface, a driving unit that moves the holding unit, a first obtaining unit that, in a state where the housing-side surface contacts the apparatus-side surface, obtains an output from the held sensor, at least one reference sensor that has a detection axis and is provided such that a direction of the detection axis matches a direction of a reference axis of the held sensor, and a second obtaining unit that obtains an output from the reference sensor.
Public/Granted literature
- US20090158811A1 Apparatus and method for inspecting sensor module Public/Granted day:2009-06-25
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