Invention Grant
US08256408B2 Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device
失效
用于线锯装置的安装板，包括其的锯切装置以及由该装置执行的线切割工艺
- Patent Title: Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device
- Patent Title (中): 用于线锯装置的安装板，包括其的锯切装置以及由该装置执行的线切割工艺
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Application No.: US12863177Application Date: 2009-02-23
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Publication No.: US08256408B2Publication Date: 2012-09-04
- Inventor: Niklaus Johann Bucher , David Baranes , Philippe Nasch
- Applicant: Niklaus Johann Bucher , David Baranes , Philippe Nasch
- Applicant Address: CH Cheseaux-sur-Lausanne
- Assignee: Applied Materials Switzerland SA
- Current Assignee: Applied Materials Switzerland SA
- Current Assignee Address: CH Cheseaux-sur-Lausanne
- Agency: Patterson & Sheridan, LLP
- Priority: EP08007834 20080423
- International Application: PCT/IB2009/000321 WO 20090223
- International Announcement: WO2009/130549 WO 20091029
- Main IPC: B28D1/08
- IPC: B28D1/08
Abstract:
The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).
Public/Granted literature
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