Invention Grant
- Patent Title: Device connector
- Patent Title (中): 设备连接器
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Application No.: US12942681Application Date: 2010-11-09
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Publication No.: US08257096B2Publication Date: 2012-09-04
- Inventor: Hiroyuki Matsuoka , Daisuke Nakagawa
- Applicant: Hiroyuki Matsuoka , Daisuke Nakagawa
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael H. Porco
- Priority: JP2009-262128 20091117
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A device connector is provided with a metal reinforcing plate (30) including an opening (31) for permitting the passage of terminal fittings, a housing main body (10), a flange (11) formed by insert molding using the reinforcing plate (30) and synthetic resin, a device-side housing portion (12) to be accommodated into a connector mounting hole, and terminal fittings (15) held in the housing main body (10) while being passed through the opening (31). The reinforcing plate (30) is beveled along a peripheral edge thereof to form an R-surface (36). Thus, the device connector is produced at a low cost and eliminates possible starting points of cracks created in the synthetic resin covering the peripheral edge of the metal reinforcing plate (30).
Public/Granted literature
- US20110117784A1 DEVICE CONNECTOR Public/Granted day:2011-05-19
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