A sealed electrical splice assembly includes a housing defining a cavity and including an opening. A conductive bus plate is retained in the cavity. A plurality of electrically conductive terminals are received in the cavity are electrically connected to the bus plate. The plurality of terminals are connected to a plurality of wire conductors. A seal plug is disposed in the cavity through the opening adapted to sealingly engage an interior surface of the housing surrounding the seal plug. An end cover overlies the seal plug disposed in the opening. The cavity receives the plurality of terminals through the end cover and the seal plug thereby allowing the seal plug to sealingly engage the plurality of wire conductors.