Invention Grant
- Patent Title: Audio jack connector with an improved contact arrangement
- Patent Title (中): 具有改进的接触布置的音频插座连接器
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Application No.: US12839430Application Date: 2010-07-20
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Publication No.: US08257116B2Publication Date: 2012-09-04
- Inventor: Zi-Qiang Zhu , Xiao-Peng Yu , Hong-Qiang Han
- Applicant: Zi-Qiang Zhu , Xiao-Peng Yu , Hong-Qiang Han
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
An audio jack connector includes an insulative housing (1) having a main body (10) defining a pair of opposite front and rear faces (11, 12) and a pair of opposite first and second side walls (15, 16), a set of columned mating portions (17) extending forwardly on the front face, and a set of receiving chambers (111) extending in the main body and passing through the mating portions for insertion of plugs (200); and a plurality of contacts (3) retained in the first side wall and arranged in several different rows along a transverse direction so as to protrude into the receiving chambers respectively, each row of the contacts being arranged along a front-to-back direction in accordance with an insertion direction of the plug and perpendicular to the transverse direction.
Public/Granted literature
- US20110014815A1 AUDIO JACK CONNECTOR WITH AN IMPROVED CONTACT ARRANGEMENT Public/Granted day:2011-01-20
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