Invention Grant
- Patent Title: Substrate transfer module and substrate processing system
- Patent Title (中): 基板转移模块和基板处理系统
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Application No.: US12180028Application Date: 2008-07-25
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Publication No.: US08257498B2Publication Date: 2012-09-04
- Inventor: Jun Yamawaku , Tsuyoshi Moriya
- Applicant: Jun Yamawaku , Tsuyoshi Moriya
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-194810 20070726
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A substrate transfer module that can prevent corrosion of components, adhesion of particles to the substrate, and increases in the manufacturing cost and the size of the substrate transfer module. A substrate transfer module is connected to a substrate processing module. The substrate processing module implements desired processing on a substrate. A substrate transfer device transfers a substrate and includes a holding unit and a moving unit. The holding unit holds the substrate, and the moving unit moves the holding unit. A transfer chamber houses the substrate transfer device in an interior thereof that is isolated from an external atmosphere. An isolation device isolates at least the holding unit and the substrate held by the holding unit from an interior atmosphere of the transfer chamber.
Public/Granted literature
- US20090028672A1 SUBSTRATE TRANSFER MODULE AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2009-01-29
Information query
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