Invention Grant
- Patent Title: Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
- Patent Title (中): 具有光稳定聚合物端点检测窗的化学机械抛光垫及其抛光方法
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Application No.: US12893656Application Date: 2010-09-29
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Publication No.: US08257545B2Publication Date: 2012-09-04
- Inventor: Adam Loyack , Alan Nakatani , Mary Jo Kulp , David G. Kelly
- Applicant: Adam Loyack , Alan Nakatani , Mary Jo Kulp , David G. Kelly
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24B49/12
Abstract:
A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane reaction product of an aromatic polyamine containing amine moieties and an isocyanate terminated prepolymer polyol containing unreacted —NCO moieties; and, a light stabilizer component comprising at least one of a UV absorber and a hindered amine light stabilizer; wherein the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted —NCO moiety stoichiometric ratio of
Public/Granted literature
Information query
