Invention Grant
US08257549B2 Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head
有权
旋转头中使用的旋转头，卡盘销以及用旋转头处理基底的方法
- Patent Title: Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head
- Patent Title (中): 旋转头中使用的旋转头，卡盘销以及用旋转头处理基底的方法
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Application No.: US12222149Application Date: 2008-08-04
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Publication No.: US08257549B2Publication Date: 2012-09-04
- Inventor: Woo-Seok Lee , Woo-Young Kim , Jeong-Yong Bae
- Applicant: Woo-Seok Lee , Woo-Young Kim , Jeong-Yong Bae
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0101075 20071008
- Main IPC: H01L21/306
- IPC: H01L21/306
Abstract:
Provided is a spin head for supporting a substrate. The spin head includes a rotatable body, and chuck pins protruding upward from the body and configured to support an edge of a substrate placed at the body when the body is rotated. Each of the chuck pins includes a vertical rod vertically disposed at the body, and a support rod extending from a side of the vertical rod and configured to make contact with the edge of the substrate placed at the body when the body is rotated. When the substrate is rotated, the vertical rod is spaced apart from the edge of the substrate. The contact portion includes a streamlined side surface. The support rod includes a contact portion. The contact portion tapers toward the end of the support rod when viewed from the top of the support rod.
Public/Granted literature
- US20090093123A1 Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head Public/Granted day:2009-04-09
Information query
IPC分类:
