Invention Grant
- Patent Title: Plating method
- Patent Title (中): 电镀方法
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Application No.: US12398818Application Date: 2009-03-05
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Publication No.: US08257574B2Publication Date: 2012-09-04
- Inventor: Hitoshi Muramatsu , Seiya Kunioka , Nobuyuki Suzuki , Akira Ishibashi , Minoru Imai , Manabu Suzuki , Masahiro Ogawa
- Applicant: Hitoshi Muramatsu , Seiya Kunioka , Nobuyuki Suzuki , Akira Ishibashi , Minoru Imai , Manabu Suzuki , Masahiro Ogawa
- Applicant Address: JP Hamamatsu-shi
- Assignee: Suzuki Motor Corporation
- Current Assignee: Suzuki Motor Corporation
- Current Assignee Address: JP Hamamatsu-shi
- Agency: Barnes & Thornburg LLP
- Priority: JP2008-058371 20080307
- Main IPC: C25D5/02
- IPC: C25D5/02

Abstract:
A plating method for pre-plating or plating a cylinder inner peripheral surface to be treated of a cylinder block by introducing treatment liquid to the cylinder inner peripheral surface by using a plating apparatus provided with a sealing jig having a sealing member and an electrode to which the seal jig is mounted includes the steps, which are performed successively: sealing the cylinder inner peripheral surface by bringing the sealing jig into contact with the cylinder inner peripheral surface; introducing the treatment liquid to the cylinder inner peripheral surface; and treating the cylinder inner peripheral surface by applying predetermined charge to the electrode of the plating apparatus and the cylinder block to thereby perform pre-plating or plating process in a state that a liquid to be treated fills a space including the cylinder inner peripheral surface. In the method, the treatment liquid introducing step is performed after confirmation of sealing by the sealing step.
Public/Granted literature
- US20090223828A1 PLATING METHOD Public/Granted day:2009-09-10
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