Invention Grant
- Patent Title: Substrate processing method, system and program
- Patent Title (中): 基板加工方法,系统和程序
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Application No.: US13073618Application Date: 2011-03-28
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Publication No.: US08257601B2Publication Date: 2012-09-04
- Inventor: Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
- Applicant: Seiichi Kaise , Noriyuki Iwabuchi , Shigeaki Kato , Hiroshi Nakamura , Takeshi Yokouchi , Mariko Shibata , Akira Obi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-318451 20041101
- Main IPC: C23F1/00
- IPC: C23F1/00

Abstract:
A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
Public/Granted literature
- US20110171830A1 SUBSTRATE PROCESSING METHOD, SYSTEM AND PROGRAM Public/Granted day:2011-07-14
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