Invention Grant
- Patent Title: Extrusion die flow modification and use
- Patent Title (中): 挤出模头流动修改和使用
-
Application No.: US12548891Application Date: 2009-08-27
-
Publication No.: US08257623B2Publication Date: 2012-09-04
- Inventor: John Charles Rector , David Robertson Treacy, Jr. , Kevin Lee Wasson
- Applicant: John Charles Rector , David Robertson Treacy, Jr. , Kevin Lee Wasson
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Joseph M. Homa; Matthew J. Mason
- Main IPC: B29C47/92
- IPC: B29C47/92 ; B28B17/00

Abstract:
An extrusion die is processed to alter the flow of extrudable material through the die by collecting data reflecting flow variations across the face of the die, constructing a graded resistance flow restrictor utilizing the data, and forcing an abrasive machining medium through the flow restrictor and die with the flow restrictor being arranged to deliver higher abrasive flow through die portions initially exhibiting low extrusion rates, the resulting die being useful for the manufacture of ceramic honeycomb bodies exhibiting a reduced incidence of shape defects attributable to die flow variations.
Public/Granted literature
- US20110049743A1 Extrusion Die Flow Modification And Use Public/Granted day:2011-03-03
Information query