Invention Grant
- Patent Title: Optical film cutting method, and apparatus using the same
- Patent Title (中): 光学薄膜切割方法及使用其的装置
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Application No.: US12670976Application Date: 2008-08-19
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Publication No.: US08257638B2Publication Date: 2012-09-04
- Inventor: Kouta Nakai , Junpei Kozasa , Masahiro Hosoi
- Applicant: Kouta Nakai , Junpei Kozasa , Masahiro Hosoi
- Applicant Address: JP Osaka JP Saitama
- Assignee: Nitto Denko Corporation,Akebono Machine Industries Co., Ltd.
- Current Assignee: Nitto Denko Corporation,Akebono Machine Industries Co., Ltd.
- Current Assignee Address: JP Osaka JP Saitama
- Agency: Cheng Law Group, PLLC
- International Application: PCT/JP2008/064745 WO 20080819
- International Announcement: WO2010/021024 WO 20100225
- Main IPC: B29C35/10
- IPC: B29C35/10 ; B23K26/38

Abstract:
A suction table 9 is disposed at a cutting action position for a polarizing film F, and holding blocks 9a and 9b, which are different in height from each other, are disposed in proximity to each other along a transport direction on a surface of the suction table 9 to form a suction groove 14. Nip rollers 11 and 12 are disposed on front and rear sides of the suction table 9 to nip opposed ends of the polarizing film F. Further, the suction table 9 suction-holds the polarizing film F in a state that the polarizing film F is inclined with the suction groove 14 located below a portion to be cut. In this state, a laser device 10 scans the polarizing film F along the suction groove 14 to cut the polarizing film F in a width direction.
Public/Granted literature
- US20100206859A1 OPTICAL FILM CUTTING METHOD, AND APPARATUS USING THE SAME Public/Granted day:2010-08-19
Information query
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