Invention Grant
- Patent Title: MEMS device and fabrication method
- Patent Title (中): MEMS器件及其制造方法
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Application No.: US12238138Application Date: 2008-09-25
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Publication No.: US08257985B2Publication Date: 2012-09-04
- Inventor: Clayton Lee Stevenson , Jason C. Green , Daryl Ross Koehl , Buu Quoc Diep
- Applicant: Clayton Lee Stevenson , Jason C. Green , Daryl Ross Koehl , Buu Quoc Diep
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.
Public/Granted literature
- US20120038019A1 MEMS Device and Fabrication Method Public/Granted day:2012-02-16
Information query
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