Invention Grant
- Patent Title: Method of fabricating a pixel array
- Patent Title (中): 制造像素阵列的方法
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Application No.: US13050956Application Date: 2011-03-18
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Publication No.: US08257992B2Publication Date: 2012-09-04
- Inventor: Yung-Hui Yeh , Chih-Ming Lai , Chun-Cheng Cheng
- Applicant: Yung-Hui Yeh , Chih-Ming Lai , Chun-Cheng Cheng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99146762A 20101230
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of fabricating a pixel array is provided. A first metal layer is formed over a substrate. The metal layer is patterned to form a plurality of data lines and a plurality of drain patterns adjacent to each data line. The data lines and the drain patterns are separated from each other. An oxide semiconductor layer and a first insulation layer covering the oxide semiconductor layer are formed over the substrate. A second metal layer is formed on the first insulation layer and patterned to form a plurality of scan lines intersected with the data lines and the drain patterns. By using the scan lines as a mask, the oxide semiconductor layer and the first insulation layer are patterned to form a plurality of oxide semiconductor channels located under each scan line. Each oxide semiconductor channel is located between one data line and one drain pattern.
Public/Granted literature
- US20120171792A1 METHOD OF FABRICATING A PIXEL ARRAY Public/Granted day:2012-07-05
Information query
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