Invention Grant
- Patent Title: Method for producing a set of chips mechanically interconnected by means of a flexible connection
- Patent Title (中): 用于通过柔性连接机械地互连的一组芯片的制造方法
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Application No.: US12452137Application Date: 2008-06-20
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Publication No.: US08258011B2Publication Date: 2012-09-04
- Inventor: Jean Brun , Bruno Mourey , Dominique Vicard
- Applicant: Jean Brun , Bruno Mourey , Dominique Vicard
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0704445 20070621
- International Application: PCT/FR2008/000867 WO 20080620
- International Announcement: WO2009/013409 WO 20090129
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.
Public/Granted literature
- US20100136746A1 METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY MEANS OF A FLEXIBLE CONNECTION Public/Granted day:2010-06-03
Information query
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