Invention Grant
- Patent Title: Method of manufacturing a power transistor module and package with integrated bus bar
- Patent Title (中): 集成母线制造功率晶体管模块和封装的方法
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Application No.: US13174048Application Date: 2011-06-30
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Publication No.: US08258014B2Publication Date: 2012-09-04
- Inventor: Cynthia Blair , Donald Fowlkes
- Applicant: Cynthia Blair , Donald Fowlkes
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
According to an embodiment of a method of manufacturing a power transistor module, the method includes mechanically fastening a first terminal, a second terminal and at least two different DC bias terminals to an electrically conductive flange; connecting the flange to a source of a power transistor device; electrically connecting the first terminal to a gate of the power transistor device; electrically connecting the second terminal to a drain of the power transistor device; mechanically fastening a bus bar to the flange which extends between and connects the DC bias terminals; and electrically connecting the bus bar to the drain via one or more RF grounded connections.
Public/Granted literature
- US20110258844A1 METHOD OF MANUFACTURING A POWER TRANSISTOR MODULE AND PACKAGE WITH INTEGRATED BUS BAR Public/Granted day:2011-10-27
Information query
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