Invention Grant
- Patent Title: Photosensitive adhesive
- Patent Title (中): 感光胶
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Application No.: US12745592Application Date: 2008-12-02
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Publication No.: US08258017B2Publication Date: 2012-09-04
- Inventor: Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
- Applicant: Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JPP2007-313886 20071204
- International Application: PCT/JP2008/071882 WO 20081202
- International Announcement: WO2009/072492 WO 20090611
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/46
Abstract:
A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
Public/Granted literature
- US20110045639A1 PHOTOSENSITIVE ADHESIVE Public/Granted day:2011-02-24
Information query
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