Invention Grant
US08258019B2 Flip chip assembly process for ultra thin substrate and package on package assembly
有权
用于超薄基板和封装组件上的封装芯片组装工艺
- Patent Title: Flip chip assembly process for ultra thin substrate and package on package assembly
- Patent Title (中): 用于超薄基板和封装组件上的封装芯片组装工艺
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Application No.: US12164404Application Date: 2008-06-30
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Publication No.: US08258019B2Publication Date: 2012-09-04
- Inventor: Weng Khoon Mong , A. Vethanayagam Rudge , Bok Sim Lim , Mun Leong Loke , Kang Eu Ong , Sih Fei Lim , Tean Wee Ong
- Applicant: Weng Khoon Mong , A. Vethanayagam Rudge , Bok Sim Lim , Mun Leong Loke , Kang Eu Ong , Sih Fei Lim , Tean Wee Ong
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20090321928A1 FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY Public/Granted day:2009-12-31
Information query
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