Invention Grant
- Patent Title: Method of manufacturing nonvolatile semiconductor memory device
- Patent Title (中): 制造非易失性半导体存储器件的方法
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Application No.: US12728763Application Date: 2010-03-22
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Publication No.: US08258033B2Publication Date: 2012-09-04
- Inventor: Nobutaka Watanabe
- Applicant: Nobutaka Watanabe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-185763 20090810
- Main IPC: H01L21/8239
- IPC: H01L21/8239

Abstract:
A nonvolatile semiconductor memory device includes: a substrate; a plurality of gate electrodes provided on the substrate, extended in a first direction parallel to an upper surface of the substrate, arranged in a matrix in an up-to-down direction perpendicular to the upper surface and a second direction, and having a through-hole respectively extended in the up-to-down direction, the second direction being orthogonal to both the first direction and the up-to-down direction; an insulation plate provided between the gate electrodes in the second direction and extended in the first direction and the up-to-down direction; a block insulation film provided on an interior surface of the through-hole and on an upper surface and a lower surface of the gate electrodes and being contact with the insulation plate; a charge storage film provided on the block insulation film; a tunnel insulation film provided on the charge storage film; and a semiconductor pillar provided in the through-hole and extended in the up-to-down direction.
Public/Granted literature
- US20110031547A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-02-10
Information query
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