Invention Grant
- Patent Title: Laser processing method for workpiece
- Patent Title (中): 工件激光加工方法
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Application No.: US12874344Application Date: 2010-09-02
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Publication No.: US08258046B2Publication Date: 2012-09-04
- Inventor: Atsushi Ueki
- Applicant: Atsushi Ueki
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2009-209765 20090910
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/301
Abstract:
A processing method for a workpiece which includes a first modified region forming step of forming first modified regions along first division lines and second division lines near the front side of the workpiece, a second modified region forming step of forming second modified regions at intersecting regions between the first division lines and the second division lines at predetermined positions between the back side of the workpiece and the first modified regions formed in the workpiece by performing the first modified region forming step, and a dividing step of applying an external force to the workpiece after performing the first and second modified region forming steps to thereby divide the workpiece along the first division lines and the second division lines into individual chips.
Public/Granted literature
- US20110056922A1 LASER PROCESSING METHOD FOR WORKPIECE Public/Granted day:2011-03-10
Information query
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